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Title
IMAPS Nordic Conference on Microelectronics Packaging, NordPac 2018
Title Supplement
12-14 June 2018, Oulu, Finland. Proceedings
Corporate Author
International Microelectronics and Packaging Society -IMAPS-, Nordic Chapter
Institute of Electrical and Electronics Engineers -IEEE-
Publisher
Publishing Place
Piscataway, NJ
Publication Date
2018
ISBN
978-952-68150-5-3
978-1-5386-8019-3