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Title

IMAPS Nordic Conference on Microelectronics Packaging, NordPac 2018

Titel Supplements
12-14 June 2018, Oulu, Finland. Proceedings
Institut
International Microelectronics and Packaging Society -IMAPS-, Nordic Chapter
Institute of Electrical and Electronics Engineers -IEEE-
Verlag
IEEE
Verlagsort
Piscataway, NJ
Datum
2018
ISBN
978-952-68150-5-3
978-1-5386-8019-3
Konferenz
Nordic Conference on Microelectronics Packaging (NordPac) 2018
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