Title

IMAPS Nordic Conference on Microelectronics Packaging, NordPac 2018
Titel Supplements
12-14 June 2018, Oulu, Finland. Proceedings
Institut
International Microelectronics and Packaging Society -IMAPS-, Nordic Chapter
Institute of Electrical and Electronics Engineers -IEEE-
Verlag
Verlagsort
Piscataway, NJ
Datum
2018
ISBN
978-952-68150-5-3
978-1-5386-8019-3
Konferenz