Title

IMAPS Nordic Conference on Microelectronics Packaging, NordPac 2018

Title Supplement

12-14 June 2018, Oulu, Finland. Proceedings

Corporate Author

International Microelectronics and Packaging Society -IMAPS-, Nordic Chapter

Institute of Electrical and Electronics Engineers -IEEE-

Publisher

Publishing Place

Piscataway, NJ

Publication Date

2018

ISBN

978-952-68150-5-3

978-1-5386-8019-3

Conference