Title

IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2014. Vol.2
Titel Supplements
Lake Buena Vista, Orlando, Florida, USA, 27 - 30 May 2014
Institut
Institute of Electrical and Electronics Engineers -IEEE-
IEEE Components, Packaging, and Manufacturing Technology Society
Verlag
Verlagsort
Piscataway, NJ
Datum
2014
ISBN
978-1-4799-5268-7
978-1-4799-5267-0
Konferenz