Title

IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2014. Vol.2

Title Supplement

Lake Buena Vista, Orlando, Florida, USA, 27 - 30 May 2014

Corporate Author

Institute of Electrical and Electronics Engineers -IEEE-

IEEE Components, Packaging, and Manufacturing Technology Society

Publisher

Publishing Place

Piscataway, NJ

Publication Date

2014

ISBN

978-1-4799-5268-7

978-1-4799-5267-0

Conference