Title

3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference, IMPACT 2008
Titel Supplements
22 - 24 Oct. 2008, Taipei. Held in conjunction with International Conference on Electronic Materials and Packaging (EMAP)
Verlag
Verlagsort
Piscataway, NJ
Datum
2008
ISBN
978-1-4244-3624-8
978-1-424-43623-1
Konferenz