Title

3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference, IMPACT 2008

Title Supplement

22 - 24 Oct. 2008, Taipei. Held in conjunction with International Conference on Electronic Materials and Packaging (EMAP)

Publisher

Publishing Place

Piscataway, NJ

Publication Date

2008

ISBN

978-1-4244-3624-8

978-1-424-43623-1

Conference