https://publica.fraunhofer.de/entities/publication/def4a8b5-26e7-4aa7-aa87-aafe348d485c
https://publica.fraunhofer.de/entities/publication/def55a87-ba60-4f4a-a6c0-72883826a803
https://publica.fraunhofer.de/entities/orgunit/def5681c-9235-4340-8fff-c8c49072a381
https://publica.fraunhofer.de/entities/publication/def58374-4b54-4734-88e5-06738061173b
https://publica.fraunhofer.de/entities/publication/def5e541-a2ca-464c-be4c-107be31b3c8a
https://publica.fraunhofer.de/entities/mainwork/def62307-0aac-4295-b4ae-479ff2106c8f
https://publica.fraunhofer.de/entities/publication/def65ffb-f809-4bad-87e5-f7016d793e66
https://publica.fraunhofer.de/entities/patent/def665f3-7344-4dea-82fe-23fbb2b44ed8
https://publica.fraunhofer.de/entities/publication/def694a4-543b-4ac4-abec-3a782fc3b311
https://publica.fraunhofer.de/entities/journal/def6b113-f2ad-4a7f-87ac-0109405af0c5
https://publica.fraunhofer.de/entities/publication/def6b849-a561-4289-942c-ff105df79183
https://publica.fraunhofer.de/entities/event/def6c972-9a1f-4aa5-9ad9-b98327ec89ce
https://publica.fraunhofer.de/entities/event/def6e3c8-94fd-4fb1-b649-1d32e4a1bc62
https://publica.fraunhofer.de/entities/publication/def6f41c-cd47-4d4e-843e-31e627295598
https://publica.fraunhofer.de/entities/publication/def72409-2a85-48fb-920e-c709a7f2b613
https://publica.fraunhofer.de/entities/project/def758f5-6d19-4ed3-9198-3bf2c3183cd6
https://publica.fraunhofer.de/entities/publication/def7b34d-7699-453f-b858-d58f12e08dab
https://publica.fraunhofer.de/entities/publication/def804b4-eece-424e-adec-0ef98226a2b9
https://publica.fraunhofer.de/entities/publication/def81f89-01bd-49b4-8344-9d2a2cd4ddf3
https://publica.fraunhofer.de/entities/publication/def8220e-37fe-408e-a5a7-160ed3f1e8af
https://publica.fraunhofer.de/entities/publication/def82ec5-a64d-4143-9abe-6cf79bb1542b
https://publica.fraunhofer.de/entities/publication/def8671c-eb0f-4b7b-a4b3-5c8f090d1adf
https://publica.fraunhofer.de/entities/publication/def892d6-6316-4f23-900f-c8edfcca3531
https://publica.fraunhofer.de/entities/event/def8e77f-8f93-49e8-90e5-a66d25dfb9e5
https://publica.fraunhofer.de/entities/patent/def8ec9c-276e-48db-b4c9-b95c8e08ce32
https://publica.fraunhofer.de/entities/publication/def8f687-c259-41b4-b908-40f7197144bb
https://publica.fraunhofer.de/entities/patent/def90314-f179-4245-8900-efec0436fe9d
https://publica.fraunhofer.de/entities/mainwork/def9094e-b0bb-494d-9601-0da4393e2b61
https://publica.fraunhofer.de/entities/publication/def94044-1888-4ef2-9fd9-55eb4e80d86a
https://publica.fraunhofer.de/entities/publication/def96b40-a3e5-4bda-8cd2-13d8cfee7671
https://publica.fraunhofer.de/entities/journal/def9ba01-db15-4bf8-b113-c9f0979549d5
https://publica.fraunhofer.de/entities/publication/def9d565-c6a7-4f13-8ba5-41204c1042fa
https://publica.fraunhofer.de/entities/event/def9e553-1d54-40f3-bffc-9b08b271c4f9
https://publica.fraunhofer.de/entities/publication/def9fc0d-b03d-4611-828d-c7ec78b9b050
https://publica.fraunhofer.de/entities/publication/defa148d-69e5-4a5b-ad88-67634b2baaaa
https://publica.fraunhofer.de/entities/project/defa1f1f-be9a-4852-96b2-fe738632b17d
https://publica.fraunhofer.de/entities/publication/defa1f9f-5def-4667-9f7d-b5d9bf36b9b9
https://publica.fraunhofer.de/entities/publication/defa2853-24dd-45f4-b116-743fbdb9f008
https://publica.fraunhofer.de/entities/publication/defa6cff-1100-46d2-97f5-b71c032f77fc
https://publica.fraunhofer.de/entities/publication/defa7e7d-70eb-4545-bf27-6291bc823ba3
https://publica.fraunhofer.de/entities/publication/defb0921-b442-42ce-ab77-694fd82ca7a0
https://publica.fraunhofer.de/entities/patent/defb5877-7b7b-4735-abda-133a090a110a
https://publica.fraunhofer.de/entities/journal/defb8e04-910c-4d9e-afb5-33f4cfd2427d
https://publica.fraunhofer.de/entities/orgunit/defba17d-ea8b-4be6-b1c9-519c5da21931
https://publica.fraunhofer.de/entities/event/defbac6c-479b-4af6-b44b-2d0140c68540
https://publica.fraunhofer.de/entities/orgunit/defbeaef-9a10-4af4-95fa-f5a8bbe44b04
https://publica.fraunhofer.de/entities/publication/defc0584-0e31-4dc3-8116-eb79975a37c9
https://publica.fraunhofer.de/entities/event/defc4573-c41c-4b69-80d3-7f12c259beb5
https://publica.fraunhofer.de/entities/publication/defc9d25-6978-495a-90a2-037d305309f1
https://publica.fraunhofer.de/entities/mainwork/defd1a9c-78f3-41b8-b622-c272ff41f360
https://publica.fraunhofer.de/entities/publication/defd3429-58bb-47de-b5eb-e906fc85dcf8
https://publica.fraunhofer.de/entities/event/defd43c7-1c2f-41af-8b92-41de5275f913
https://publica.fraunhofer.de/entities/publication/defdb32f-7fd1-4ce6-95c5-78c0f0868213
https://publica.fraunhofer.de/entities/publication/defdfb67-52bc-4564-90f1-ac1c5a879a38
https://publica.fraunhofer.de/entities/publication/defe96ac-c585-4f59-8356-22ab85b9fea9
https://publica.fraunhofer.de/entities/publication/defea85b-2fb3-4c60-979e-74297fc73e69
https://publica.fraunhofer.de/entities/publication/defeaed2-7425-4282-8249-704cdf92aa4b
https://publica.fraunhofer.de/entities/mainwork/deff2d3b-7302-4ed8-a754-0b0e134739cb
https://publica.fraunhofer.de/entities/mainwork/deff47d8-2f26-4073-b364-92b17fc77eaf
https://publica.fraunhofer.de/entities/project/deff5abb-f644-480e-9684-dfb965814dc2
https://publica.fraunhofer.de/entities/publication/df0001b3-c8dc-4db3-b6e8-442e88ab000f
https://publica.fraunhofer.de/entities/publication/df00039c-4d64-40d7-b18d-c376abdb5721
https://publica.fraunhofer.de/entities/event/df0044a7-aeac-43ae-af30-15bc662a8fe0
https://publica.fraunhofer.de/entities/publication/df0068ce-1880-4697-a57e-0033932cd2fc
https://publica.fraunhofer.de/entities/publication/df008948-2b53-4e76-a327-afce3dffa556
https://publica.fraunhofer.de/entities/publication/df009188-5c85-479a-8726-7b848e78e8c1
https://publica.fraunhofer.de/entities/publication/df0097e7-a6f2-4a0c-abf4-6d2e47554230
https://publica.fraunhofer.de/entities/publication/df011682-9121-407c-991d-4d5d82596219
https://publica.fraunhofer.de/entities/event/df0116a2-72f6-4591-852f-0272a636ea63
https://publica.fraunhofer.de/entities/publication/df01557d-9cdc-425d-a3c6-d7b6c0d43fbe
https://publica.fraunhofer.de/entities/event/df016253-d7b8-4f97-adc5-8ee0f73a8bc8
https://publica.fraunhofer.de/entities/event/df017cb3-23ec-44ca-bef3-e920c4d0be5e
https://publica.fraunhofer.de/entities/event/df01d90e-d394-456a-91c5-9a8b29869ae4
https://publica.fraunhofer.de/entities/publication/df01e25c-6a6b-431b-b677-d6786f113d7f
https://publica.fraunhofer.de/entities/event/df01f6e4-52fe-44f2-aed7-0f8f1feb7f24
https://publica.fraunhofer.de/entities/publication/df0203eb-2cde-4bf6-a91c-090567b47cee
https://publica.fraunhofer.de/entities/mainwork/df021d43-e107-43fd-891b-b670ed84152f
https://publica.fraunhofer.de/entities/publication/df026cc0-a774-4023-beef-a5c9a86bd794
https://publica.fraunhofer.de/entities/publication/df02a5f4-cff5-4ab2-9f48-7cbac5a0fae0
https://publica.fraunhofer.de/entities/publication/df02ec14-8555-4564-99f4-26e0f026fcc3
https://publica.fraunhofer.de/entities/publication/df030179-af03-49d9-9a24-343854b8c755
https://publica.fraunhofer.de/entities/publication/df035f2d-8009-4cb6-85c4-082b6c0383fd
https://publica.fraunhofer.de/entities/publication/df036947-baaa-404d-b702-6f0570e85ce0
https://publica.fraunhofer.de/entities/publication/df03fe75-a204-4c31-beb9-650fd251eeae
https://publica.fraunhofer.de/entities/publication/df0403d6-c6ae-4651-8f59-3f29984e654d
https://publica.fraunhofer.de/entities/publication/df0419a3-9cdb-4163-8763-7cbaf6a0dacc
https://publica.fraunhofer.de/entities/patent/df042269-76eb-4003-88f4-05a7a27241a4
https://publica.fraunhofer.de/entities/publication/df044c38-09f2-4af3-9302-77387c76b8e7
https://publica.fraunhofer.de/entities/journal/df044e8a-8d1a-4144-9778-a7f823eaaf9a
https://publica.fraunhofer.de/entities/mainwork/df04e4ce-672a-45eb-9abb-d2146a7b769a
https://publica.fraunhofer.de/entities/publication/df050361-f86d-4caa-aa4f-92faf6fc4fc2
https://publica.fraunhofer.de/entities/publication/df051f7e-6787-4ef1-b892-a3c6fcb4d63a
https://publica.fraunhofer.de/entities/publication/df05237a-8464-4ee8-b26f-710a6c2aad36
https://publica.fraunhofer.de/entities/publication/df0523f3-f5bb-46fc-ac0a-d551b0fe50cf
https://publica.fraunhofer.de/entities/publication/df056420-9e30-414f-b138-577051b1d1f4
https://publica.fraunhofer.de/entities/publication/df057fc8-295a-436a-96b7-a9a7a2ca8333
https://publica.fraunhofer.de/entities/publication/df05c51d-3a6c-4e5f-b2e3-1f20ee5c8fae
https://publica.fraunhofer.de/entities/orgunit/df06208a-d656-4e86-bc56-8b359339dc40
https://publica.fraunhofer.de/entities/publication/df0625d2-03aa-45ca-90b7-47a82eec6e26
https://publica.fraunhofer.de/entities/publication/df066812-caba-4b9b-9ddb-a8a2c1e51b10
https://publica.fraunhofer.de/entities/mainwork/df06de07-42ee-4ec5-a505-23c1a6b57f5b
https://publica.fraunhofer.de/entities/patent/df06fa90-956f-4309-9ed7-a1a113d9433c
https://publica.fraunhofer.de/entities/publication/df06fcf1-0a1e-4ebe-aa5d-b88e5c56dd91
https://publica.fraunhofer.de/entities/publication/df0718ac-f1a3-4e71-9a4d-04317dd522e8
https://publica.fraunhofer.de/entities/publication/df074388-4c90-43cc-af83-ee3be97556ce
https://publica.fraunhofer.de/entities/person/df07846d-8267-45bf-b81c-22d8b295bda8
https://publica.fraunhofer.de/entities/publication/df079233-acf6-4777-8219-652571409e43
https://publica.fraunhofer.de/entities/publication/df07c1bf-20ed-4f15-a152-f6eaded089ff
https://publica.fraunhofer.de/entities/publication/df0818b1-7e45-4c2f-bf18-031c8c15fdd3
https://publica.fraunhofer.de/entities/event/df082e99-aa0a-41e1-b081-365f901cf483
https://publica.fraunhofer.de/entities/publication/df0856a2-d534-4a64-a1a5-45bb0f87df6d
https://publica.fraunhofer.de/entities/event/df0869d1-2f50-4b9d-b5f1-a1c474e932cd
https://publica.fraunhofer.de/entities/mainwork/df0880d8-0aed-4157-a140-4157ca331aa2
https://publica.fraunhofer.de/entities/patent/df088386-d44d-4548-85ca-f5856f478ee8
https://publica.fraunhofer.de/entities/publication/df08b188-ea57-4219-87a0-4647cb2c3285
https://publica.fraunhofer.de/entities/publication/df08c532-d1cb-4811-9ed3-769e69db1801
https://publica.fraunhofer.de/entities/publication/df091cbe-74be-42c7-b7d0-40ad16439aa3
https://publica.fraunhofer.de/entities/event/df09495d-6a4c-4d60-8d2d-52621ccb4346
https://publica.fraunhofer.de/entities/project/df095c8b-e223-4b88-b77f-300a0611ddb6
https://publica.fraunhofer.de/entities/publication/df09d030-ebf2-4df9-87be-ea5ce8d09502
https://publica.fraunhofer.de/entities/mainwork/df0a0cde-00cb-4dbe-9dbc-a8d0e6213a3f
https://publica.fraunhofer.de/entities/publication/df0a372b-5b74-44a8-851b-e1d6c4652c14
https://publica.fraunhofer.de/entities/publication/df0ad972-9267-4e84-a567-19af9982b611
https://publica.fraunhofer.de/entities/publication/df0adb9f-eda8-4bd0-8ceb-dfa72ec51921
https://publica.fraunhofer.de/entities/publication/df0ae30f-b939-419b-94ee-386e2f1bff77
https://publica.fraunhofer.de/entities/event/df0ae3d4-e94d-4ac7-8877-8f492d79e06b
https://publica.fraunhofer.de/entities/publication/df0b22fe-d101-49a6-a55a-53dd5c056ac6
https://publica.fraunhofer.de/entities/publication/df0b3daa-8d6b-453d-a222-bf8ca893f0a6
https://publica.fraunhofer.de/entities/mainwork/df0bdfb8-6be6-4e9b-a6c9-44827ccc451d
https://publica.fraunhofer.de/entities/publication/df0c2725-9d99-42d9-9f0d-04e0a443110e
https://publica.fraunhofer.de/entities/publication/df0c298c-8391-4cb3-8b4a-a1c566839334
https://publica.fraunhofer.de/entities/publication/df0c3d25-8532-40d1-9f7d-e240eef4b1c8
https://publica.fraunhofer.de/entities/mainwork/df0c5cc0-28e9-4bbc-80c8-b42de348348b
https://publica.fraunhofer.de/entities/publication/df0c715e-4793-433c-ae91-d6da541d7b18
https://publica.fraunhofer.de/entities/publication/df0c7344-6dab-438a-8078-021635f7da7c
https://publica.fraunhofer.de/entities/publication/df0c8307-a8b7-4540-a425-356af51f5e8c
https://publica.fraunhofer.de/entities/publication/df0c8d08-3da3-4363-9a84-b28479adddce
https://publica.fraunhofer.de/entities/publication/df0ca548-a68d-44a9-8284-163980dcfd39
https://publica.fraunhofer.de/entities/publication/df0d4c8f-fc9e-4cf8-a74d-a5d01c2f9e0a
https://publica.fraunhofer.de/entities/patent/df0d8dd0-de11-4211-94ae-feee09696163
https://publica.fraunhofer.de/entities/publication/df0da4f3-247d-4e4c-b295-ef8c6b010c76
https://publica.fraunhofer.de/entities/publication/df0db8f8-0ef6-4d3d-95cd-11e27890cb5a
https://publica.fraunhofer.de/entities/publication/df0dd2a3-7df1-462f-8fe0-e941601dfa31
https://publica.fraunhofer.de/entities/person/df0de2dc-f916-4105-81be-307ff99336b0
https://publica.fraunhofer.de/entities/publication/df0de569-f61b-4355-8a37-280ad9b8bf47
https://publica.fraunhofer.de/entities/event/df0e30fc-ddc4-45c7-bea6-b3697a7e29a5
https://publica.fraunhofer.de/entities/publication/df0e6d3c-6e14-496c-91a3-d4d246c06e49
https://publica.fraunhofer.de/entities/event/df0ec026-39fe-42a5-ae8d-47d71ab9261e
https://publica.fraunhofer.de/entities/publication/df0ec2f9-270a-4198-84fc-b5d4cef5aa4f
https://publica.fraunhofer.de/entities/publication/df0ed919-47fb-484d-ab27-4be87c7ae7af
https://publica.fraunhofer.de/entities/journal/df0ef35d-5c6e-4d2f-a1cf-136d8cd462f9
https://publica.fraunhofer.de/entities/journal/df0f03e3-c119-4320-ac11-1f8b4576342b
https://publica.fraunhofer.de/entities/mainwork/df0f56a8-ebb7-4aca-96cb-2efc7f1f56ae
https://publica.fraunhofer.de/entities/event/df0fdabb-7c04-437a-8663-8986037e83b7
https://publica.fraunhofer.de/entities/event/df0fef6e-1fbe-4ca5-b2c3-c12028cf1fac
https://publica.fraunhofer.de/entities/publication/df0ffde1-4dd2-4e5f-88fa-10b672b30c99
https://publica.fraunhofer.de/entities/publication/df10170d-6be6-4637-abb7-358b8855f7fb
https://publica.fraunhofer.de/entities/publication/df103bcd-7a6f-44eb-91cf-85c7190af5e2
https://publica.fraunhofer.de/entities/event/df1045a9-a1f2-4d43-8fa1-65f2888f5b7d
https://publica.fraunhofer.de/entities/publication/df109740-54b9-432d-bb6f-3e52ec5038b8
https://publica.fraunhofer.de/entities/publication/df10af64-fb55-458f-acd6-aad3f16165ea
https://publica.fraunhofer.de/entities/publication/df10ba5f-d622-44c1-bcef-a4c3397a33f1
https://publica.fraunhofer.de/entities/event/df10d0b6-5153-42cf-bbc1-9f9168ae5a1f
https://publica.fraunhofer.de/entities/publication/df10debc-5554-4815-999f-d47a2762c396
https://publica.fraunhofer.de/entities/event/df10ec6b-dba9-4862-807b-5065b2a19ad0
https://publica.fraunhofer.de/entities/event/df10f92f-f564-4f58-959f-65617e6cccfe
https://publica.fraunhofer.de/entities/mainwork/df110501-9b4a-4c86-947d-fe86ae04221c
https://publica.fraunhofer.de/entities/orgunit/df116ed2-f74d-4180-a3d6-4db78dacb6de
https://publica.fraunhofer.de/entities/mainwork/df119077-2f79-4280-8964-c6c11b4f2abd
https://publica.fraunhofer.de/entities/event/df119510-ed95-4bf6-b7d6-ea15a7bb7639
https://publica.fraunhofer.de/entities/publication/df11f0fc-99ab-4fb2-b082-82e02755234d
https://publica.fraunhofer.de/entities/publication/df11f23c-3859-46a0-a88f-629434cdc5db
https://publica.fraunhofer.de/entities/publication/df12651a-a4ad-4518-b1c8-a8c555ddedad
https://publica.fraunhofer.de/entities/publication/df126d85-ecd4-4008-bc22-c6f7360a7885
https://publica.fraunhofer.de/entities/publication/df12cd5d-f068-4678-abf4-4cdc4ca77af6
https://publica.fraunhofer.de/entities/event/df12cdc6-e875-4cf3-abbb-5fe52e70ba93
https://publica.fraunhofer.de/entities/publication/df1354a8-de5c-4930-b79c-aad9a0d51e7f
https://publica.fraunhofer.de/entities/publication/df135714-5090-42ae-ac6d-c5f04a627fda
https://publica.fraunhofer.de/entities/project/df1367c7-1d25-445a-b236-75dd4c04739c
https://publica.fraunhofer.de/entities/orgunit/df13a7ef-cb89-4ce2-957f-10e0532d7c21
https://publica.fraunhofer.de/entities/publication/df13c34b-7c03-4fe6-99fb-3218437b2e64
https://publica.fraunhofer.de/entities/project/df13f0e1-8955-486f-9bb9-55ae4bda0434
https://publica.fraunhofer.de/entities/publication/df13f61d-d7df-4b7c-a2b3-0840fff7a56e
https://publica.fraunhofer.de/entities/publication/df14028c-2714-4b7b-8769-13b5cf229466
https://publica.fraunhofer.de/entities/mainwork/df1404b3-e5c5-4964-b74f-18e80572b93f
https://publica.fraunhofer.de/entities/orgunit/df140913-2008-4502-a81e-4cdf182bcfe1
https://publica.fraunhofer.de/entities/orgunit/df142141-9bc3-442d-8011-c5930ce27c8e
https://publica.fraunhofer.de/entities/publication/df1437be-a2ed-425b-be5a-0ab1d347bb9a
https://publica.fraunhofer.de/entities/publication/df143b86-4d80-46e9-b93e-1145e02af6bb
https://publica.fraunhofer.de/entities/publication/df1499aa-1152-49b4-9394-db9b922fe653
https://publica.fraunhofer.de/entities/publication/df14ad15-e602-48a5-9e38-8ae0955327d4
https://publica.fraunhofer.de/entities/journal/df14e4c0-027a-4e0f-8220-ed85c1a4e166
https://publica.fraunhofer.de/entities/publication/df14fbd4-d29d-417f-88e2-3fee1b6a5037
https://publica.fraunhofer.de/entities/publication/df15227e-de20-444b-9ed5-31799c2372ce
https://publica.fraunhofer.de/entities/orgunit/df1529de-fc24-4788-a71c-036403205923
https://publica.fraunhofer.de/entities/publication/df1548d0-690c-4e96-8ff9-d4dd05efe513
https://publica.fraunhofer.de/entities/publication/df15e4a2-4468-4563-937d-37c4d80cfd97
https://publica.fraunhofer.de/entities/publication/df1641c4-9988-478f-871a-309f337456e0
https://publica.fraunhofer.de/entities/journal/df1654bd-1878-42bd-8313-d274f6f5d80f
https://publica.fraunhofer.de/entities/event/df168c32-d076-4128-a1af-35aa30d89d60
https://publica.fraunhofer.de/entities/event/df16f29c-11ec-472c-9ce9-4b9312b01101
https://publica.fraunhofer.de/entities/publication/df1721bb-54f4-4a9d-a633-35a46e061c58
https://publica.fraunhofer.de/entities/journal/df17eea8-0318-4679-af19-bc80dd7a0790
https://publica.fraunhofer.de/entities/publication/df1809be-36ba-46cf-977e-7efce9cf52a5
https://publica.fraunhofer.de/entities/publication/df1813d8-a1af-4a82-a6aa-02c1bdab7779
https://publica.fraunhofer.de/entities/publication/df182529-f937-4da1-836c-5613ca09ee9e
https://publica.fraunhofer.de/entities/mainwork/df182b7e-7615-4a86-9b93-4b16f875962c
https://publica.fraunhofer.de/entities/publication/df1844e0-64c9-4724-a8d3-20687f62a6b0
https://publica.fraunhofer.de/entities/publication/df186661-94eb-403f-abd0-58df2ad33a64
https://publica.fraunhofer.de/entities/mainwork/df189b46-9e90-4904-a74b-13f7cbebf362
https://publica.fraunhofer.de/entities/publication/df18ce8c-f46b-4036-b795-409f715302d9
https://publica.fraunhofer.de/entities/publication/df18eb0a-e106-4fe5-98d2-db0c7256f0f7
https://publica.fraunhofer.de/entities/publication/df18f84b-af4b-4e3c-81fd-ec69ab241ba0
https://publica.fraunhofer.de/entities/publication/df1907b1-3166-4ce1-8f5a-a4792a46159d
https://publica.fraunhofer.de/entities/publication/df19306d-50af-45c9-bdf5-2fac9e5d545c
https://publica.fraunhofer.de/entities/event/df198558-7551-4845-9489-609f71f1fa71
https://publica.fraunhofer.de/entities/mainwork/df199147-8c19-4329-9cac-139ce13c0490
https://publica.fraunhofer.de/entities/journal/df1991c7-368d-4a0c-8f25-d6ad4e53f74a
https://publica.fraunhofer.de/entities/publication/df19a825-878b-4bfc-8846-0c8459f009ee
https://publica.fraunhofer.de/entities/publication/df19cb75-9e1c-4cd2-ac94-f9eaa0b1e7c5
https://publica.fraunhofer.de/entities/orgunit/df1a110f-cdef-4485-95e2-e8cb563eeec1
https://publica.fraunhofer.de/entities/publication/df1a1fea-6928-4872-9292-221a0d9ab540
https://publica.fraunhofer.de/entities/publication/df1a7b6b-6060-45ae-8b36-b68e12e8b2df
https://publica.fraunhofer.de/entities/mainwork/df1a7d66-d417-4760-aadb-048e53041a81
https://publica.fraunhofer.de/entities/mainwork/df1ad717-4c0a-4ceb-92bf-ecb89f444a9d
https://publica.fraunhofer.de/entities/publication/df1af313-4bb0-4e05-a75c-761c88917883
https://publica.fraunhofer.de/entities/event/df1b21c6-b89b-41f0-a470-4b132184d351
https://publica.fraunhofer.de/entities/publication/df1b5af8-468c-4473-97e0-137e6a5809f0
https://publica.fraunhofer.de/entities/event/df1b9c43-3039-4917-b6f1-5200eb59d57b
https://publica.fraunhofer.de/entities/publication/df1bbd10-a591-4408-85c1-969a01de1d65
https://publica.fraunhofer.de/entities/publication/df1bd4f4-0cd6-479a-b4da-f755a6940ef0
https://publica.fraunhofer.de/entities/publication/df1c2077-e0f4-4498-bace-baf867548582
https://publica.fraunhofer.de/entities/project/df1c3dab-f91e-4dba-b4c4-4ebd7cd27985
https://publica.fraunhofer.de/entities/patent/df1c5c15-c427-45aa-97b2-b055606a39e3
https://publica.fraunhofer.de/entities/publication/df1c64aa-eb2e-41b0-8788-f34aaae451cd
https://publica.fraunhofer.de/entities/orgunit/df1c785a-41f9-4151-852d-0dd91bbdda30
https://publica.fraunhofer.de/entities/publication/df1c84eb-d115-4bc6-8e74-268b29251650
https://publica.fraunhofer.de/entities/publication/df1cb73a-0b1a-4599-b0fa-33be1142c343
https://publica.fraunhofer.de/entities/mainwork/df1cd291-ed8d-42a6-bb6b-23106445524f
https://publica.fraunhofer.de/entities/event/df1cf737-5de5-4168-a9de-6ad9393c8a7e
https://publica.fraunhofer.de/entities/publication/df1d2bb3-0a21-4172-add0-d38832941a93
https://publica.fraunhofer.de/entities/publication/df1d72ba-e2f0-4c0a-9627-3ebd9f5c18f8
https://publica.fraunhofer.de/entities/orgunit/df1d823d-c2c7-48e2-9a84-8c863c4ba486
https://publica.fraunhofer.de/entities/journal/df1d8680-9878-4570-a417-b21bd6e0b9cf
https://publica.fraunhofer.de/entities/event/df1d9c56-3165-408c-a3e6-ede436961d21
https://publica.fraunhofer.de/entities/mainwork/df1da4cd-4b89-4473-9af9-63cf7ba665da
https://publica.fraunhofer.de/entities/publication/df1db70d-1c95-4397-9160-bae66625dd82
https://publica.fraunhofer.de/entities/patent/df1db77b-0f14-4657-b7f8-6c7c672ddbeb
https://publica.fraunhofer.de/entities/publication/df1db98f-fce9-4b8c-a9cb-edc435d19cc8
https://publica.fraunhofer.de/entities/publication/df1de0a9-2904-4792-a3da-bf1bd031ed78
https://publica.fraunhofer.de/entities/publication/df1de126-17f2-4fae-a93a-7cabf81151d4
https://publica.fraunhofer.de/entities/publication/df1e11d9-ddbb-4fb0-826f-b77a23739d88
https://publica.fraunhofer.de/entities/patent/df1e1bcd-8e91-4a74-8d47-8e943cb55992
https://publica.fraunhofer.de/entities/event/df1e82c7-d633-4f50-9593-fa4ec161bb5b
https://publica.fraunhofer.de/entities/publication/df1ed3ff-8da4-4168-81a3-e15e54053204
https://publica.fraunhofer.de/entities/event/df1ee16a-6b96-445d-9c3a-7d681516c8af
https://publica.fraunhofer.de/entities/publication/df1ee80e-ec40-4e3c-8277-755bc3482a3f
https://publica.fraunhofer.de/entities/publication/df1f0e83-41d0-4ac0-938d-6c505fa37cc4
https://publica.fraunhofer.de/entities/mainwork/df1f168a-10d7-4cfa-bc1f-5a12b2beb349
https://publica.fraunhofer.de/entities/publication/df1f25ad-cedb-4bf4-b8a1-8b57f7d15311
https://publica.fraunhofer.de/entities/publication/df1f3fd1-4d62-453b-8c12-b13768d9bcfe