https://publica.fraunhofer.de/entities/publication/e6351506-ca2b-4f7b-8b67-cd4f6c701320
https://publica.fraunhofer.de/entities/publication/e6358ba1-fb1b-4c6c-8be4-655eeaea12ab
https://publica.fraunhofer.de/entities/publication/e6358f29-ddb1-4271-9d74-8b6fae5b0d0c
https://publica.fraunhofer.de/entities/mainwork/e6359335-9e78-4ac3-8436-f725125f04be
https://publica.fraunhofer.de/entities/publication/e635a387-221e-47ba-9424-7bfa3634d77f
https://publica.fraunhofer.de/entities/publication/e63624f3-512a-4aa3-8ffc-e3d6ed66a1eb
https://publica.fraunhofer.de/entities/publication/e63656af-5b46-4f64-9c55-16f7a4b4e32b
https://publica.fraunhofer.de/entities/publication/e636c2ec-aeff-44f6-8545-91fcc8c44493
https://publica.fraunhofer.de/entities/orgunit/e636f291-e848-4224-b94e-5d2f8bbc93b2
https://publica.fraunhofer.de/entities/person/e636f5eb-117a-4832-8c21-9f78f9c27b15
https://publica.fraunhofer.de/entities/event/e6371590-d493-4b80-8322-570666c5eff2
https://publica.fraunhofer.de/entities/publication/e6371934-706e-4c51-b046-23e3c40f3289
https://publica.fraunhofer.de/entities/publication/e6372fc8-fb70-4719-b49f-6169d753b3a7
https://publica.fraunhofer.de/entities/publication/e6377b1b-3b3f-4a3a-9d12-570639261601
https://publica.fraunhofer.de/entities/event/e6378d46-e5dc-44ae-8e12-b1c20de66fd3
https://publica.fraunhofer.de/entities/publication/e637bc6b-f7fa-45ce-8264-0f09b67e07b1
https://publica.fraunhofer.de/entities/publication/e637dd18-2fa0-4849-9624-bc82dd67fe53
https://publica.fraunhofer.de/entities/publication/e637dd53-ce1a-4235-913d-862fdc9d79a3
https://publica.fraunhofer.de/entities/publication/e637dd97-79ae-4dc7-acb0-81dc4c9835be
https://publica.fraunhofer.de/entities/publication/e6380087-11a3-4daf-844b-7aa0beb73716
https://publica.fraunhofer.de/entities/mainwork/e6381c3f-e0e5-427e-831f-579b5bf9d0f9
https://publica.fraunhofer.de/entities/publication/e6387720-4642-493f-9dc0-4ba684e2f8d7
https://publica.fraunhofer.de/entities/publication/e63878ea-42d8-430f-924e-079b8c24ec84
https://publica.fraunhofer.de/entities/publication/e6387d78-407b-4972-937b-166ff1e8bd21
https://publica.fraunhofer.de/entities/publication/e6388b5f-08f2-4f43-ba38-0bc8c5115d06
https://publica.fraunhofer.de/entities/publication/e6390e77-d182-4b59-888a-c58c4b9138bd
https://publica.fraunhofer.de/entities/publication/e6392b09-1907-49e5-8bd5-4e8c406f9392
https://publica.fraunhofer.de/entities/publication/e63938c4-bcc6-4b93-95ef-e071649697bd
https://publica.fraunhofer.de/entities/publication/e6394e69-562b-41b5-8dee-2b9fe6dbc760
https://publica.fraunhofer.de/entities/publication/e6399309-8b02-4512-80e1-f571a2e08dbf
https://publica.fraunhofer.de/entities/publication/e639caa2-a408-4b1f-8feb-daf89eb49038
https://publica.fraunhofer.de/entities/mainwork/e639f759-4f17-45c1-9d5a-82cfc32882b1
https://publica.fraunhofer.de/entities/publication/e63a07e1-afdf-48a3-a96c-f1240aa188c1
https://publica.fraunhofer.de/entities/publication/e63a5bfb-dde5-4b04-bdfd-8aa7c4241379
https://publica.fraunhofer.de/entities/patent/e63a7d2f-773d-405f-842e-4e71916a9bea
https://publica.fraunhofer.de/entities/orgunit/e63a8561-24ec-4876-a466-b882c1f6e42d
https://publica.fraunhofer.de/entities/publication/e63a8efe-5656-427c-840c-ac8837e7b066
https://publica.fraunhofer.de/entities/orgunit/e63a9353-6c41-4b94-8041-0632ae789a96
https://publica.fraunhofer.de/entities/journal/e63a9bd3-54d4-4f56-a972-2a42f8225a97
https://publica.fraunhofer.de/entities/publication/e63aaadd-690b-41cc-87bb-4c3808367559
https://publica.fraunhofer.de/entities/event/e63adc68-82d1-4837-9627-dbcbb2baab18
https://publica.fraunhofer.de/entities/publication/e63ae7ec-972e-45ab-9885-45b830d7816e
https://publica.fraunhofer.de/entities/mainwork/e63aff1d-035a-4aa6-9c74-debd8b0436d8
https://publica.fraunhofer.de/entities/event/e63b1aa0-1e65-4d99-aea4-aac6c368a3c7
https://publica.fraunhofer.de/entities/event/e63b57d8-e199-4bbe-8817-0e3182d0ee16
https://publica.fraunhofer.de/entities/orgunit/e63bb837-cf53-482c-a19a-f3a22951fdbd
https://publica.fraunhofer.de/entities/publication/e63be8d7-3ec0-412c-86a4-1387561b60c1
https://publica.fraunhofer.de/entities/publication/e63c320a-5ed7-472c-b821-972ae80106ff
https://publica.fraunhofer.de/entities/orgunit/e63c5b9a-94a6-4175-9560-580e5bfa92be
https://publica.fraunhofer.de/entities/event/e63c75d6-8871-4dbf-8806-f21096ecf9d9
https://publica.fraunhofer.de/entities/mainwork/e63c777a-b653-4606-a012-212c69272ce1
https://publica.fraunhofer.de/entities/publication/e63d54be-2b0c-458a-b430-e675260c0156
https://publica.fraunhofer.de/entities/publication/e63d6e40-fd48-4eba-bc71-ecf2e39efaf8
https://publica.fraunhofer.de/entities/orgunit/e63d7760-d2bd-4522-81b5-6fbdae46a103
https://publica.fraunhofer.de/entities/event/e63d7a77-9982-448a-8aae-05d895086862
https://publica.fraunhofer.de/entities/publication/e63d880e-d48f-46e2-9cdc-aeea68e18719
https://publica.fraunhofer.de/entities/event/e63e3bdd-a433-4497-b655-02eb4d7b1fcd
https://publica.fraunhofer.de/entities/patent/e63e4e2b-467b-41dd-bc93-bd2313ff36ad
https://publica.fraunhofer.de/entities/event/e63eaa76-2714-4f1e-9b7e-0aa79db5372a
https://publica.fraunhofer.de/entities/event/e63ec08b-e3dc-4fe0-808d-53617bfd7f8b
https://publica.fraunhofer.de/entities/publication/e63edec0-36e3-4429-843d-4a4530f3ff56
https://publica.fraunhofer.de/entities/publication/e63f08b6-9d55-47a3-8517-058199855847
https://publica.fraunhofer.de/entities/event/e63f1a52-6737-4e37-b3bb-60007a26417a
https://publica.fraunhofer.de/entities/publication/e63f281d-843a-4a70-bc88-08e47f076def
https://publica.fraunhofer.de/entities/event/e63f2977-22c9-4703-9990-aa96600bb5b2
https://publica.fraunhofer.de/entities/publication/e63f5c81-825c-4a47-bf6a-430a4df74d30
https://publica.fraunhofer.de/entities/publication/e63f6ad1-eab9-4afb-987d-ceafacbe7d5d
https://publica.fraunhofer.de/entities/publication/e63f786c-7f7a-41b8-a5a7-6c68daafd4a6
https://publica.fraunhofer.de/entities/orgunit/e63f92e0-255a-4184-bc22-728429f1a256
https://publica.fraunhofer.de/entities/publication/e63fc21c-1ae1-4542-b5c1-09d19b90f90b
https://publica.fraunhofer.de/entities/publication/e63fdda8-78be-44c3-811d-db8579738c95
https://publica.fraunhofer.de/entities/publication/e64006d8-a247-4ce2-b865-4363b18e747f
https://publica.fraunhofer.de/entities/publication/e6407d97-fd77-4d2b-a1e7-6d9ec2d5e659
https://publica.fraunhofer.de/entities/mainwork/e640de39-8aea-4cde-af28-1e166416b70d
https://publica.fraunhofer.de/entities/event/e640e425-22a3-4b4d-92ad-49588ad5d379
https://publica.fraunhofer.de/entities/publication/e6413a86-4ba5-4dd3-bceb-ebf622830837
https://publica.fraunhofer.de/entities/publication/e64197dc-df53-4774-bea7-7533a473ff4d
https://publica.fraunhofer.de/entities/publication/e641c97c-4ad5-454a-9eee-75cc9ffa6014
https://publica.fraunhofer.de/entities/patent/e641ea5d-3efb-4df2-9ccc-7e32511cf693
https://publica.fraunhofer.de/entities/mainwork/e6423002-7975-4b96-b3e4-45c192405fc2
https://publica.fraunhofer.de/entities/publication/e6425211-ad0d-48ae-83c5-cdea7d2d6290
https://publica.fraunhofer.de/entities/event/e642d2d3-cb2b-40a2-9f57-b7445697fc9b
https://publica.fraunhofer.de/entities/mainwork/e6432655-ee11-43f8-950a-6dd47e8a621e
https://publica.fraunhofer.de/entities/event/e6434b48-cc76-43de-b047-a387b89b6cbd
https://publica.fraunhofer.de/entities/publication/e6434cb3-6a5b-47ff-aa7d-baa1725ee842
https://publica.fraunhofer.de/entities/project/e6436e8f-e30c-428f-8cb1-1f8fda4ce4f3
https://publica.fraunhofer.de/entities/publication/e6438d29-9517-4ff6-81df-5aef86aa98b4
https://publica.fraunhofer.de/entities/publication/e643a977-dca4-4dbf-acc5-a193ecb800ac
https://publica.fraunhofer.de/entities/event/e643ee72-4028-4abe-8a90-5d98d20c2658
https://publica.fraunhofer.de/entities/orgunit/e643ef3c-25b5-4a7e-88f9-287bf081f19c
https://publica.fraunhofer.de/entities/event/e643f4e9-3809-4a22-a7cd-6613b7acd955
https://publica.fraunhofer.de/entities/publication/e64405df-faa7-4650-bbf4-db768a377375
https://publica.fraunhofer.de/entities/publication/e6440b10-1f52-497e-9565-172b7ed2b104
https://publica.fraunhofer.de/entities/publication/e6440e5d-cdf3-427f-9711-734bf86d5394
https://publica.fraunhofer.de/entities/publication/e6441623-77d7-4f83-8143-2e501d4b58e1
https://publica.fraunhofer.de/entities/mainwork/e644231e-f469-4d03-be3c-f94c756f80bf
https://publica.fraunhofer.de/entities/publication/e6444603-de2a-476b-b0bf-cb76762a53ae
https://publica.fraunhofer.de/entities/publication/e6444f66-db3a-48a9-a9b1-cdec4cf8a00b
https://publica.fraunhofer.de/entities/orgunit/e6447412-bbe4-4c46-8f34-ef04791c56d2
https://publica.fraunhofer.de/entities/event/e644c424-7f5d-4673-bdb9-d5b154f72893
https://publica.fraunhofer.de/entities/journal/e644e1fa-0dd0-4694-8876-2a1c10dafcb2
https://publica.fraunhofer.de/entities/publication/e6453c0b-a093-456e-b8a8-609e717a0134
https://publica.fraunhofer.de/entities/publication/e6455527-4752-4a93-8a11-bc47a2d51e2d
https://publica.fraunhofer.de/entities/publication/e6455a73-7cab-48f3-b6dd-2aff568e077a
https://publica.fraunhofer.de/entities/orgunit/e6458663-ff2c-47f9-9023-813945049c02
https://publica.fraunhofer.de/entities/mainwork/e6458977-7ba2-4286-9099-dc1937aa64b9
https://publica.fraunhofer.de/entities/publication/e6458f1e-475c-4040-b50e-273ef46c1823
https://publica.fraunhofer.de/entities/publication/e6460a45-b52b-4f32-afaa-334022836238
https://publica.fraunhofer.de/entities/orgunit/e646251c-c8a1-4c74-aa14-f1d9f3b9b3af
https://publica.fraunhofer.de/entities/publication/e64633c8-4afa-4cd1-986e-e2bd7da1217d
https://publica.fraunhofer.de/entities/mainwork/e646a34d-d4f9-45fd-86eb-c78e4b21bb92
https://publica.fraunhofer.de/entities/publication/e646cb5a-e36a-4058-8d61-93a15cead41d
https://publica.fraunhofer.de/entities/mainwork/e646fad5-0c8d-444f-9dfa-a637f23b93b2
https://publica.fraunhofer.de/entities/publication/e647216d-7fa4-40dd-8f11-bd5457347b72
https://publica.fraunhofer.de/entities/publication/e6473b4c-963f-45f4-9f76-390d96c8d2c8
https://publica.fraunhofer.de/entities/publication/e647dad3-00ed-4057-a939-cedb0300a10d
https://publica.fraunhofer.de/entities/publication/e6481dc6-b271-46a3-bb19-36d332589f86
https://publica.fraunhofer.de/entities/publication/e64827fb-68c5-4c45-9953-e9991cebbe7b
https://publica.fraunhofer.de/entities/publication/e64829f0-fd71-42de-a2f3-ce09d082e4c7
https://publica.fraunhofer.de/entities/publication/e6482fc4-cc7a-4d14-ae10-9ff037536f78
https://publica.fraunhofer.de/entities/publication/e64831d1-b532-461e-8e73-a55005679bfc
https://publica.fraunhofer.de/entities/project/e6488b38-f5fe-4a29-a475-eba2f4ccc31a
https://publica.fraunhofer.de/entities/publication/e648dfac-4cb0-4c1a-af2e-9b053682fd04
https://publica.fraunhofer.de/entities/event/e648ec16-9ea3-42c6-b777-09c3168ab4ef
https://publica.fraunhofer.de/entities/mainwork/e648ed2b-c62d-4d63-aa42-98fe0b06585b
https://publica.fraunhofer.de/entities/publication/e6492bd0-b22f-45ea-bced-260c4a43920a
https://publica.fraunhofer.de/entities/publication/e6495928-af27-4a20-ac90-2caec47d78cc
https://publica.fraunhofer.de/entities/publication/e6495f90-40c0-4588-a212-4a769938ddfb
https://publica.fraunhofer.de/entities/publication/e64962cd-ca0a-43d9-8030-6ac53bcf8754
https://publica.fraunhofer.de/entities/publication/e6497409-26c3-4858-826a-20d7824e9d42
https://publica.fraunhofer.de/entities/publication/e6498f71-26d7-40df-84e6-4bd0e7949a06
https://publica.fraunhofer.de/entities/publication/e649c098-51cb-4474-91cb-38309d532b0a
https://publica.fraunhofer.de/entities/publication/e649c3f2-cd60-498e-b67c-2a0a2e1acfc6
https://publica.fraunhofer.de/entities/publication/e64a176c-922c-4e71-afae-cc434d309b95
https://publica.fraunhofer.de/entities/publication/e64a1bdb-07eb-4219-b5f9-e9b4d756d7f8
https://publica.fraunhofer.de/entities/orgunit/e64a1c6f-6dbb-422e-9cda-cf7bed2acad4
https://publica.fraunhofer.de/entities/publication/e64aac62-3821-4208-a884-a86b0d2dc19a
https://publica.fraunhofer.de/entities/publication/e64ac78d-6ab3-44ac-b30c-c1ae288bf1af
https://publica.fraunhofer.de/entities/orgunit/e64add32-2013-4c1e-bcc6-26434cb76b9c
https://publica.fraunhofer.de/entities/mainwork/e64afd8a-95e1-4672-a976-9e70ddaf2db5
https://publica.fraunhofer.de/entities/mainwork/e64b1723-6685-46a8-b9f7-9ade7c9182e8
https://publica.fraunhofer.de/entities/publication/e64b62b7-1b9b-4d7b-9cc9-2d9ae1a725e5
https://publica.fraunhofer.de/entities/publication/e64bb1f0-eb73-499b-b030-dbd67559ab27
https://publica.fraunhofer.de/entities/mainwork/e64bc9ff-0e0c-4dcb-8be7-43315accae82
https://publica.fraunhofer.de/entities/publication/e64bf7e0-5e2e-4191-a52b-7cef19183e64
https://publica.fraunhofer.de/entities/publication/e64c0462-51d1-4d22-bb9c-0314d37648bf
https://publica.fraunhofer.de/entities/mainwork/e64c123a-0985-435a-ad40-5277636fefc5
https://publica.fraunhofer.de/entities/mainwork/e64c5129-4448-47e7-ad33-eea42fbcdc20
https://publica.fraunhofer.de/entities/publication/e64c51dd-441e-4413-be42-86f8d88dc018
https://publica.fraunhofer.de/entities/orgunit/e64c5d09-0598-4913-8753-696fdbd53b55
https://publica.fraunhofer.de/entities/project/e64c7268-af3f-412a-a14e-582d9c0c2cc7
https://publica.fraunhofer.de/entities/patent/e64c76b2-0760-4d87-ade9-433ece1dbc03
https://publica.fraunhofer.de/entities/publication/e64c794c-6292-465c-a50f-3f154df4330d
https://publica.fraunhofer.de/entities/publication/e64c962f-450b-4dcc-ad3a-d6f3645244da
https://publica.fraunhofer.de/entities/project/e64cc2cd-e8d4-4a6e-8e05-969ef17c7721
https://publica.fraunhofer.de/entities/mainwork/e64d134f-ae0d-47a6-8e3c-400ebae687fe
https://publica.fraunhofer.de/entities/event/e64d9895-4e15-4405-9aaf-c2993b6b1bd8
https://publica.fraunhofer.de/entities/publication/e64db599-8444-4466-b61c-09fc07636344
https://publica.fraunhofer.de/entities/mainwork/e64dbe1e-2ccc-4dd2-9233-5cc4844a10b0
https://publica.fraunhofer.de/entities/publication/e64dc666-1c48-4511-9687-e37378ddd357
https://publica.fraunhofer.de/entities/publication/e64e21b9-3515-4822-bdea-399c3ac2b5e1
https://publica.fraunhofer.de/entities/mainwork/e64e2cbf-9c37-4c06-82be-59bd66580512
https://publica.fraunhofer.de/entities/publication/e64e3d80-b464-4e8b-8ac5-e35e9d512026
https://publica.fraunhofer.de/entities/publication/e64e928e-0af6-4a4b-8552-9e2a6d56de6f
https://publica.fraunhofer.de/entities/publication/e64e97df-8043-4a0c-aa81-c24669ee04a2
https://publica.fraunhofer.de/entities/mainwork/e64e9c3e-1e6f-44ee-8f30-bb1a4fe757a6
https://publica.fraunhofer.de/entities/publication/e64e9e5d-025e-48e9-9feb-65af44d2a7cb
https://publica.fraunhofer.de/entities/publication/e64eeea2-b754-4cef-8f76-0ed6659bc59c
https://publica.fraunhofer.de/entities/publication/e64f00f6-ba8f-4ee1-bf04-46be5a85efd1
https://publica.fraunhofer.de/entities/publication/e64f04f9-1356-42b1-a97c-5cedf67fccd1
https://publica.fraunhofer.de/entities/publication/e64f219e-5975-4050-9c83-be50296d1006
https://publica.fraunhofer.de/entities/patent/e64f30d2-6bb6-4f80-ba04-ca692dd12f27
https://publica.fraunhofer.de/entities/publication/e64f4a17-12f6-476f-8cf1-5e13aa817581
https://publica.fraunhofer.de/entities/publication/e64fb46b-5893-40f3-bb6d-b67ff03247bc
https://publica.fraunhofer.de/entities/mainwork/e650256b-cea8-45e2-902e-0ebe8097a0ef
https://publica.fraunhofer.de/entities/mainwork/e6504c60-4185-4763-b092-3840d09df2fd
https://publica.fraunhofer.de/entities/publication/e6507321-acbd-48f1-bb99-97cf992c1d7a
https://publica.fraunhofer.de/entities/publication/e65083b8-803f-4b00-b6c3-a692b1d334f8
https://publica.fraunhofer.de/entities/event/e650c090-83c1-488a-9b6a-3e168ac0b7e8
https://publica.fraunhofer.de/entities/publication/e650e924-b148-471b-91a4-993aa5c0454d
https://publica.fraunhofer.de/entities/publication/e651375c-c6fa-4944-bbd6-73777ccbe49d
https://publica.fraunhofer.de/entities/publication/e65172c7-7f45-4e80-9a53-d7b3d62425d0
https://publica.fraunhofer.de/entities/publication/e65173c8-5fe5-4b8d-aab0-00b0ab0a8d3c
https://publica.fraunhofer.de/entities/publication/e6517d9b-95a8-480d-b055-6ea85c6f24a6
https://publica.fraunhofer.de/entities/orgunit/e6518862-511f-453f-a2fe-9c43fe049c99
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