High-voltage monolithic 3D capacitors based on through-silicon-via technology

Under CopyrightGrünler, SaeidehSaeidehGrünlerRattmann, GudrunGudrunRattmannErlbacher, TobiasTobiasErlbacherBauer, AntonAntonBauerFrey, LotharLotharFrey2022-03-1326.1.20162015https://publica.fraunhofer.de/handle/publica/39064810.24406/publica-fhg-390648en670620530High-voltage monolithic 3D capacitors based on through-silicon-via technologyposter