10th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2009

2022-03-022022-03-022009978-1-4244-4160-0978-1-4244-4159-4https://publica.fraunhofer.de/handle/publica/14857510th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2009