DTIP 2015, 17th Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS

Benoit, CharlotMita, YoshioNouet, PascalPressecq, FrancisSchröpfer, GeroldRencz, MartaSchneider, Peter2022-03-122022-03-122015https://publica.fraunhofer.de/handle/publica/388395enmodelingsmart systemsmanufacturingMEMSRF devicessimulationintegrated process621004DTIP 2015, 17th Symposium on Design, Test, Integration and Packaging of MEMS/MOEMSconference proceeding