Bischoff, J.J.Bischoff2022-03-032022-03-031992https://publica.fraunhofer.de/handle/publica/181554The results of the dynamic-mechanical thermoanalysis of adhesives based on epoxy, polyurethane or phenolic resins are presented. The typical stiffness, damping and softening characteristics are discussed with respect to the moisture influence. The dynamic mechanical thermoanalysis is used to describe the curing characteristic of adhesives directly in the bondline between steel sheets.deadhesivedynamic mechanical thermoanalysismoisture influencethermo mechanical characteristicthermosettorsion pendulum620660671book article