11th international thermal, mechanical & multi-physics simulation, and experiments in microelectronics and microsystems, EuroSimE 2010

2022-03-022022-03-022010978-1-4244-7026-6978-1-4244-7027-3https://publica.fraunhofer.de/handle/publica/15025911th international thermal, mechanical & multi-physics simulation, and experiments in microelectronics and microsystems, EuroSimE 2010