2022-03-022022-03-022012978-1-4673-1638-5978-1-4673-1635-41-4673-1635-0978-1-4673-1637-81-4673-1637-71-4673-1638-5https://publica.fraunhofer.de/handle/publica/1549417th International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT 2012. Proceedings