Enabling Silver-Free Metallization of the Rear Side of iTOPCon Cells Through Laser Bonding of Thin Aluminum Foil

John, OliverOliverJohnOurinson, DanielDanielOurinsonEmanuel, GernotGernotEmanuelBrand, AndreasAndreasBrandNekarda, JanJanNekardaPreu, RalfRalfPreu2024-12-172024-12-172024Note-ID: 0000A692https://publica.fraunhofer.de/handle/publica/480787enEnabling Silver-Free Metallization of the Rear Side of iTOPCon Cells Through Laser Bonding of Thin Aluminum Foilpresentation