Azdasht, G.G.AzdashtKloeser, J.J.KloeserKasulke, P.P.Kasulke2022-03-082022-03-081997https://publica.fraunhofer.de/handle/publica/303771The method involves providing a deformable substrate (11) and using a form tool (15). The substrate has a polyimide film (12) sandwiched between two metallised layers (13,14), e.g. of copper. During production, the metallisation layers are simultaneously pressed by displacement of the substrate. The substrate is displaced in a process involving pressure and temperature using the form tool and e.g. application of e.g. current, laser radiation, or ultrasound, the through contact is formed. USE/ADVANTAGE - For multi-layer technology, multi-grid array, and ball-grid array. Permits cheap formation of through-contact with substrate. Provides chip carrier arrangement using substrate preparation with reduced expenditure.de608621patent1995-19522338