Processing of tungsten- and molybdenum-copper housings for microelectronic packaging via metal injection moulding (MIM)

Knüwer, M.M.KnüwerWichmann, K.-H.K.-H.WichmannMeinhardt, M.M.Meinhardt2022-03-092022-03-092000https://publica.fraunhofer.de/handle/publica/336319en620660671Processing of tungsten- and molybdenum-copper housings for microelectronic packaging via metal injection moulding (MIM)conference paper