The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects

Grossmann, G.2022-03-022022-03-022011978-0-85729-236-0978-0-85729-235-30-85729-235-8https://publica.fraunhofer.de/handle/publica/153052The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects