Köck, A.A.KöckWimmer-Teubenbacher, R.R.Wimmer-TeubenbacherSosada-Ludwikovska, F.F.Sosada-LudwikovskaRohracher, K.K.RohracherWachmann, E.E.WachmannHerold, M.M.HeroldWelden, T. anT. anWeldenKim, J.M.J.M.KimAli, Z.Z.AliPoenninger, A.A.PoenningerStahl-Offergeld, M.M.Stahl-OffergeldHohe, H.-P.H.-P.HoheLorenz, J.J.LorenzErlbacher, T.T.ErlbacherDolmans, G.G.DolmansOffermans, P.P.OffermansVandecasteele, M.M.VandecasteeleYurchenko, O.O.YurchenkoSicard, O. vonO. vonSicardPohle, R.R.PohleUdrea, F.F.UdreaFalco, C.C.FalcoFlandre, D.D.FlandreBol, D.D.BolComini, E.E.CominiZappa, D.D.ZappaGardner, J.J.GardnerCole, M.M.ColeTheunis, J.J.TheunisPeters, J.J.PetersBaldwin, A.A.Baldwin2022-03-142022-03-142019https://publica.fraunhofer.de/handle/publica/40629210.1109/TRANSDUCERS.2019.88084182-s2.0-85071922589This paper summarizes the outcome of the EC FP7 project MSP - Multi Sensor Platform for Smart Building Management (Grant Agreement No. 611887). The MSP consortium comprising 17 partners from 6 European countries developed a full manufacturing chain for 3D system integration, which has never been realized before. It enables 3D-integration of highly sophisticated components and sensor devices on a CMOS electronic platform chip. The final multi-sensor system comprises a variety of gas sensors as well as optical sensors for ultraviolet, visible and infrared light. The MSP demonstrator system implemented in a wearable wristband device integrates a total of 57 sensors - this is a worldwide unique sensor system.en3D-System Integrationheterogeneous integrationmulti-sensor devicemultifunctional nanomaterialssmart sensor system621670620530006conference paper