Klengel, R.R.KlengelBennemann, S.S.BennemannPetzold, M.M.Petzold2022-03-112022-03-112009https://publica.fraunhofer.de/handle/publica/363315The paper demonstrates that new failure modes can be analyzed and understood if an improved comprehensive flow in diagnostics involving non-destructive failure localization, ion-beam-supported target preparation, high-resolution electron microscopy and ultra-sensitive surface analytics are implemented in the physical failure analysis chain. For illustration, the potential of combining new non-destructive Lock-In-Thermography (LIT), 2D/3D-X-Ray inspec-tion and Scanning Acoustic Microscopy (SAM) to localize fine pitch wire bond failures inside moulded packages will be shown. In addition to non-destructive methods, the increasing demands related to current physics of failure approaches in reliability aspects require ultra-high-resolution microstructure investigations. Corrosive failing of the intermetal-lic Au4Al formed in the Au bond/Al pad contact is discussed. Results are presented based on preparation with Fo-cused Ion Beam (FIB) device followed by Scanning Electron Microscopy (SEM) and Transmission Electron Micros-copy (TEM) allowing analysing the corrosion process. Further application of Time-of-Flight Secondary Ion Mass Spectroscopy (ToF-SIMS) verified the presence of low concentrated contaminations as a root cause.enwire bondingreliabilityfailure analysis620conference paper