22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021

2022-03-022022-03-022021978-1-6654-1374-9978-1-6654-1373-2https://publica.fraunhofer.de/handle/publica/16674322nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021