Copper Interconnects. New Contact Metallurgies/Structures, and Low-k Interlevel Dielectrics II

Mathad, G.S.2022-03-022022-03-0220031-56677-390-3https://publica.fraunhofer.de/handle/publica/140181Copper Interconnects. New Contact Metallurgies/Structures, and Low-k Interlevel Dielectrics II