23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2022)

2022-06-012022-06-012022978-1-6654-5837-5978-1-6654-5836-8https://publica.fraunhofer.de/handle/publica/41810223rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2022)