English
Deutsch
Log In
Password Login
or
Log in with Fraunhofer Smartcard
Research Outputs
Projects
Researchers
Institutes
Statistics
Fraunhofer-Gesellschaft
Home
Fraunhofer-Gesellschaft
Hauptwerk
3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012
Information
Publications
Export
Statistics
Options
Title
3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012
Titel Supplements
Tokyo, Japan; 22-23 May 2012
Institut
Institute of Electrical and Electronics Engineers -IEEE-
Verlag
IEEE
Verlagsort
New York, NY
Datum
2012
Konferenz
International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) 2012