Title

IEEE 14th International Interconnect Technology Conference and Materials for Advanced Metallization, IITC/MAM 2011

Title Supplement

Dresden, Germany, 8 - 12 May 2011

Corporate Author

Institute of Electrical and Electronics Engineers -IEEE-

Publisher

Publishing Place

New York, NY

Publication Date

2011

ISBN

978-1-4577-0503-8

978-1-4577-0501-4

1-4577-0501-X

978-1-4577-0502-1

Conference