Title

International 3D Systems Integration Conference, 3DIC 2024

Title Supplement

25-27 September 2024, Sendai, Japan

Corporate Author

Institute of Electrical and Electronics Engineers -IEEE-

Publisher

Publication Date

2024

ISBN

979-8-3315-1651-2

979-8-3315-1650-5

DOI

10.1109/3DIC63395.2024

Conference

International 3D Systems Integration Conference 2024

Acronym

3DIC

Language

English