Title

28th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2022

Title Supplement

September 28 - 30, 2022, Dublin

Corporate Author

Institute of Electrical and Electronics Engineers -IEEE-

Publisher

Publication Date

2022

ISBN

978-1-6654-9230-0

978-1-6654-9229-4

DOI

10.1109/THERMINIC57263.2022

Conference

International Workshop on Thermal Investigations of ICs and Systems 2022

Acronym

THERMINIC

Language

English