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  4. On-Chip Direct Laser Writing of Spectral Filter Structures for Terahertz Field-Effect Transistors
 
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2023
Conference Paper
Title

On-Chip Direct Laser Writing of Spectral Filter Structures for Terahertz Field-Effect Transistors

Abstract
We demonstrate first results of 3D direct laser writing (DLW) of metallic filter structures on narrow-band antenna-coupled field-effect transistors (TeraFET) directly on the detector chip. The chip itself contains a spectroscopic line array of resonant TeraFETs ranging from 0.53 to 1.98 THz. We apply a 3D laser metal writing (DLW) process directly on the die, printing filter structures made of silver particles for the narrowing of the frequency response and the suppression of spurious waves. In our first measurements, we investigate changes in the detection resonance frequency in comparison to bare TeraFET arrays from the chip foundry.
Author(s)
Kocybik, Michael
Fraunhofer-Institut für Techno- und Wirtschaftsmathematik ITWM  
Holstein, Jakob
Goethe-Universität Frankfurt am Main
Waller, Erik Hagen
Fraunhofer-Institut für Techno- und Wirtschaftsmathematik ITWM  
Lisauskas, Alvydas
Goethe-Universität Frankfurt am Main
Roskos, Hartmut G.
Goethe-Universität Frankfurt am Main
Bauer, Maris  
Fraunhofer-Institut für Techno- und Wirtschaftsmathematik ITWM  
Friederich, Fabian
Fraunhofer-Institut für Techno- und Wirtschaftsmathematik ITWM  
Mainwork
International Conference on Infrared Millimeter and Terahertz Waves Irmmw Thz
Funder
Deutsche Forschungsgemeinschaft  
Conference
48th International Conference on Infrared, Millimeter, and Terahertz Waves, IRMMW-THz 2023
DOI
10.1109/IRMMW-THz57677.2023.10298873
Language
English
Fraunhofer-Institut für Techno- und Wirtschaftsmathematik ITWM  
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