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  4. On-Chip Antenna for Electronic Photonic Integrated D-Band Wireless Applications
 
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November 17, 2024
Conference Paper
Title

On-Chip Antenna for Electronic Photonic Integrated D-Band Wireless Applications

Abstract
This paper presents the implementation of an on-chip double folded dipole antenna using backside etching technique derived from a silicon photonic SiGe BiCMOS approach. Silicon photonics have found extensive utilisation in communication data center applications however there is not much research for wireless communication, radar and sensing applications. In this paper, a folded dipole antenna, by the etching the electronic photonic technology, targeting the frequency bandwidth the mid of D-Band has been designed and measured on the wafer prober. To the best of the authors knowledge, it is the first on-chip D-Band antenna for EPIC process.
Author(s)
Tas, Deniz Gezmis
Fraunhofer-Institut für Elektronische Mikrosysteme und Festkörper-Technologien EMFT  
Breun, Sascha
Fraunhofer-Institut für Elektronische Mikrosysteme und Festkörper-Technologien EMFT  
Hagelauer, Amelie  
Fraunhofer-Institut für Elektronische Mikrosysteme und Festkörper-Technologien EMFT  
Dietz, Marco
Fraunhofer-Institut für Elektronische Mikrosysteme und Festkörper-Technologien EMFT  
Weigel, Robert
Fraunhofer-Institut für Elektronische Mikrosysteme und Festkörper-Technologien EMFT  
Mainwork
IEEE Asia-Pacific Microwave Conference, APMC 2024  
Conference
Asia-Pacific Microwave Conference 2024  
DOI
10.1109/APMC60911.2024.10867795
Language
English
Fraunhofer-Institut für Elektronische Mikrosysteme und Festkörper-Technologien EMFT  
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