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  4. A D-Band Front-End T/R MMIC in a 70-nm GaN HEMT Technology
 
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2025
Conference Paper
Title

A D-Band Front-End T/R MMIC in a 70-nm GaN HEMT Technology

Abstract
This paper demonstrates a D-band transmit/receive (T/R) front-end MMIC based on a 70-nm GaN-on-SiC HEMT technology. It features a small chip size of only 3 mm2. Hence, it allows seamless integration into phased array front-end modules. At a 3-dB bandwidth of 131 to 144 GHz, it delivers a peak saturated output power (Psat) of 20 dBm, an output-referred 1-dB compression point (OP1-dB) of 16.5 dBm, a peak power added efficiency (PAEmax) of 7.3 % and a minimum noise figure (NF) of 7 dB. To the best of the authors’ knowledge, this is the first GaN-based T/R front-end MMIC operating at D-band.
Author(s)
Zieciak, Thomas
Fraunhofer-Institut für Angewandte Festkörperphysik IAF  
Neininger, Philipp  orcid-logo
Fraunhofer-Institut für Angewandte Festkörperphysik IAF  
Friesicke, Christian  
Fraunhofer-Institut für Angewandte Festkörperphysik IAF  
Quay, Rüdiger  orcid-logo
Fraunhofer-Institut für Angewandte Festkörperphysik IAF  
Brückner, Peter  
Fraunhofer-Institut für Angewandte Festkörperphysik IAF  
Mainwork
IEEE/MTT-S International Microwave Symposium, IMS 2025  
Project(s)
Advanced Packaging and Heterogeneous Integration for Electronic Components and Systems Pilot Line  
Funder
European Commission  
Conference
International Microwave Symposium 2025  
DOI
10.1109/IMS40360.2025.11103926
Language
English
Fraunhofer-Institut für Angewandte Festkörperphysik IAF  
Keyword(s)
  • Front-end

  • D-band

  • gallium nitride (GaN)

  • high-electron-mobility transistor (HEMT)

  • low-noise amplifier (LNA)

  • monolithic microwave integrated circuit (MMIC)

  • power amplifier (PA)

  • single pole double throw (SPDT) switch

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