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  4. Microfabricated albedo insensitive sun position sensor system in silicon carbide with integrated 3D optics and CMOS electronics
 
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2023
Journal Article
Title

Microfabricated albedo insensitive sun position sensor system in silicon carbide with integrated 3D optics and CMOS electronics

Abstract
The next generation of satellites will need to tackle tomorrow's challenges for communication, navigation and observation. In order to do so, it is expected that the amount of satellites in orbit will keep increasing, form smart constellations and miniaturize individual satellites to make access to space cost effective. To enable this next generation of activities in space, it is vital to ensure the ability of these satellites to properly navigate themselves. This control starts with attitude measurement by the dedicated sensors on the satellite, commonly performed by sun position sensors. The state-of-the art is confronted by large signal distortions caused by light reflected by the Earth's albedo as well as keeping up with the satellite miniaturization trend. This work aims to address both these issues, by presenting a microfabricated albedo insensitive sun position sensor in silicon carbide with wafer-level integrated optics. The presented 10 mm×10 mm×1 mm system reaches a mean angular accuracy of 5.7° in a ±37° field-of-view and integrates an on-chip temperature sensor with a -3.9 mV K-1 sensitivity in the 20 °C to 200 °C range.
Author(s)
Romijn, Joost
Vollebregt, Sten
Bie, Vincent G. de
Middelburg, Luke M.
El Mansouri, Brahim
Zeijl, Henk W. van
May, Alexander  
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB  
Erlbacher, Tobias  
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB  
Leijtens, Johan A.P.
Zhang, Guoqi
Sarro, Pasqualina Maria
Journal
Sensors and Actuators. A  
Open Access
DOI
10.1016/j.sna.2023.114268
Additional link
Full text
Language
English
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB  
Keyword(s)
  • 4H-SiC

  • Integrated optics

  • Optical sensors

  • Silicon carbide

  • Space instrumentation

  • Sun position sensors

  • Thermocompressive bonding

  • UV sensors

  • Wafer-level packaging

  • Wide bandgap

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