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  4. Combined electronic speckle pattern interferometry and digital holography for analysis of deformations in magnetic shape memory actuators
 
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May 2022
Conference Paper
Title

Combined electronic speckle pattern interferometry and digital holography for analysis of deformations in magnetic shape memory actuators

Abstract
Materials with magnetic shape memory (MSM) are promising candidates for application in next generation devices, such as actuators and switching valves. They exhibit elongation and contraction in a magnetic field and allow to achieve fast switching times in the order of milliseconds while maintaining high positioning precision over millions of cycles. Studying and developing applications using these materials creates a need for fast and accurate methods for analyzing their shape and deformations. We present a technology that utilizes capabilities of two interferometric methods - digital holography (DH) and electronic speckle pattern interferometry (ESPI). While digital holography enables high-precision 3D measurement of the object surface, electronic speckle pattern interferometry provides data on high-frequency deformations with nanometer accuracy. Combining both techniques allows to obtain comprehensive information about the morphology and dynamics of samples.
Author(s)
Laskin, Gennadii  
Fraunhofer-Institut für Physikalische Messtechnik IPM  
Heider, Jonas
Schnetzler, René
Fratz, Markus  
Fraunhofer-Institut für Physikalische Messtechnik IPM  
Schiller, Annelie  
Fraunhofer-Institut für Physikalische Messtechnik IPM  
Bertz, Alexander  
Fraunhofer-Institut für Physikalische Messtechnik IPM  
Laufenberg, Markus
Carl, Daniel  
Fraunhofer-Institut für Physikalische Messtechnik IPM  
Mainwork
Unconventional Optical Imaging III  
Conference
Conference "Unconventional Optical Imaging" 2022  
DOI
10.1117/12.2619698
Language
English
Fraunhofer-Institut für Physikalische Messtechnik IPM  
Keyword(s)
  • Digital holography

  • ESPI

  • Speckle interferometry

  • Interferometric imaging

  • Real-time deformation measurement

  • In-line inspection

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