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  4. Combined electronic speckle pattern interferometry and digital holography for analysis of deformations in magnetic shape memory actuators
 
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May 2022
Conference Paper
Titel

Combined electronic speckle pattern interferometry and digital holography for analysis of deformations in magnetic shape memory actuators

Abstract
Materials with magnetic shape memory (MSM) are promising candidates for application in next generation devices, such as actuators and switching valves. They exhibit elongation and contraction in a magnetic field and allow to achieve fast switching times in the order of milliseconds while maintaining high positioning precision over millions of cycles. Studying and developing applications using these materials creates a need for fast and accurate methods for analyzing their shape and deformations. We present a technology that utilizes capabilities of two interferometric methods - digital holography (DH) and electronic speckle pattern interferometry (ESPI). While digital holography enables high-precision 3D measurement of the object surface, electronic speckle pattern interferometry provides data on high-frequency deformations with nanometer accuracy. Combining both techniques allows to obtain comprehensive information about the morphology and dynamics of samples.
Author(s)
Laskin, Gennadii
Fraunhofer-Institut fĂ¼r Physikalische Messtechnik IPM
Heider, Jonas
Schnetzler, René
Fratz, Markus
Fraunhofer-Institut fĂ¼r Physikalische Messtechnik IPM
Schiller, Annelie
Fraunhofer-Institut fĂ¼r Physikalische Messtechnik IPM
Bertz, Alexander
Fraunhofer-Institut fĂ¼r Physikalische Messtechnik IPM
Laufenberg, Markus
Carl, Daniel
Fraunhofer-Institut fĂ¼r Physikalische Messtechnik IPM
Hauptwerk
Unconventional Optical Imaging III
Konferenz
Conference "Unconventional Optical Imaging" 2022
Thumbnail Image
DOI
10.1117/12.2619698
Language
English
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Fraunhofer-Institut fĂ¼r Physikalische Messtechnik IPM
Tags
  • Digital holography

  • ESPI

  • Speckle interferometr...

  • Interferometric imagi...

  • Real-time deformation...

  • In-line inspection

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