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Temperature Challenges for Integrated Systems due to High Power Density
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2021
Presentation
Title
Temperature Challenges for Integrated Systems due to High Power Density
Title Supplement
Presentation held at ECPE Online Tutorial "Wide-Bandgap User Training", 20.05.2021
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Author(s)
Schletz, Andreas
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB
Bayer, Christoph Friedrich
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB
Hutzler, Aaron
AHMT GmbH
Conference
Tutorial "Wide-Bandgap User Training" 2021
DOI
10.24406/publica-fhg-411242
File(s)
N-635218.pdf (3.9 MB)
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Rights
Under Copyright
Language
English
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB
Keyword(s)
power semiconductors
DC-link capacitor
electrical insulation
die attach
high temperature
