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State of the Art Packaging
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2019
Presentation
Title
State of the Art Packaging
Title Supplement
Presentation held at ECPE Tutorial Wide-Bandgap User Training, 27.02.2019, Graz, Austria
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Author(s)
Schletz, Andreas
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB
Endruschat, Achim
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB
Heckel, Thomas
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB
Conference
Tutorial "Wide-Bandgap User Training" 2019
DOI
10.24406/publica-fhg-404221
File(s)
N-538035.pdf (3.19 MB)
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Rights
Under Copyright
Language
English
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB