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Production of low cost encapsulation materials on weatherable substrates
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2015
Conference Paper
Title
Production of low cost encapsulation materials on weatherable substrates
Author(s)
Kucukplnar, E.
Kiese, S.
Miesbauer, O.
Noller, K.
Amberg-Schwab, S.
Lohwasser, W.
Vacca, P.
MacDonald, B.
Meier, S.
Wiel, B. van der
Schilinsky, P.
Mainwork
15th TAPPI European PLACE Conference 2015
Conference
European PLACE Conference 2015
Language
English
Fraunhofer-Institut für Silicatforschung ISC
Fraunhofer-Institut für Verfahrenstechnik und Verpackung IVV