Selective silver sintering of semiconductor dies on PCB

Organic printed circuit boards (PCB) together with standard joining technologies like soldering or adhesive bonding offer a cheap and widely used solution for signal and power electronics. These joining technologies reach their limit for high temperatures even though the PCB materials have still great potential. This work proposes silver sintering as a new joining technology for the mounting of bare die semiconductors directly onto the PCB for high temperature applications. Prototypes have been prepared. To prove the feasibility a lifetime and reliability test is carried out. An active power cycling test has been conducted. The test results prove the applicability of silver sintering for die attach on PCB. In the last section the concept of selective silver sintering is out lined.