Investigations on 3-dimensional temperature distribution in a FLATCON-type CPV module
The thermal flow in a FLATCON®-type CPV module is investigated theoretically and experimentally. For the simulation a model in the computational fluid dynamics (CFD) software SolidWorks Flow Simulation was established. In order to verify the simulation results the calculated and measured temperatures were compared assuming the same operating conditions (wind speed and direction, direct normal irradiance (DNI) and ambient temperature). Therefore, an experimental module was manufactured and equipped with temperature sensors at defined positions. In addition, the temperature distribution on the back plate of the module was displayed by infrared images. The simulated absolute temperature and the distribution compare well with an average deviation of only 3.3 K to the sensor measurements. Finally, the validated model was used to investigate the influence of the back plate material on the temperature distribution by replacing the glass material by aluminum. The simulation showed that it is important to consider heat dissipation by radiation when designing a CPV module.