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  4. H-Band quartz-silicon leaky-wave lens with air-bridge interconnect to GaAs front-end
 
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2021
Journal Article
Title

H-Band quartz-silicon leaky-wave lens with air-bridge interconnect to GaAs front-end

Abstract
Thanks to the large bandwidth availability, millimeter and sub-millimeter wave systems are getting more attractive to be used in a wide range of applications, such as high-resolution radar or high-speed communications. In this contribution, a new lens antenna in-package solution is presented for the H-band (220-320 GHz), including a wideband quartz-cavity leaky-wave feed combined with an air-bridge chip interconnect technology, based on spray coating and laser lithography. This interconnection acts as a wideband, low-loss transition between the GaAs front-end and the quartz antenna, avoiding the use of expensive waveguide split-blocks. An antenna prototype including the interconnect has been manufactured and characterized, validating the full-wave simulated results for the integrated H-band leaky-wave with aperture efficiency higher than 74% over 34% bandwidth, and radiation efficiency higher than 70% over 37%of bandwidth.
Author(s)
Campo, Marta Arias
IMST, Kamp-Lintford
Holc, Katarzyna  
Fraunhofer-Institut für Angewandte Festkörperphysik IAF  
Weber, Rainer  
Fraunhofer-Institut für Angewandte Festkörperphysik IAF  
Martino, Carmine de
Delft University
Spirito, Marco
Delft University
Leuther, Arnulf  
Fraunhofer-Institut für Angewandte Festkörperphysik IAF  
Bruni, Simona
IMST, Kamp-Lintford
Llombart, Nuria
Delft University
Journal
IEEE Transactions on Terahertz Science and Technology  
DOI
10.1109/TTHZ.2021.3049640
Language
English
Fraunhofer-Institut für Angewandte Festkörperphysik IAF  
Keyword(s)
  • mm-wave

  • H-band

  • lens antenna

  • leaky-wave antenna

  • air-bridge chip interconnect

  • off-chip antenna

  • Antenna-in-Package

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