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2012
Journal Article
Titel
Developing a model for the bond heel lifetime prediction of thick aluminium wire bonds
Abstract
Purpose - The purpose of this paper is to establish a law on the durability of thick aluminium wire bonds in low cycle fatigue for different geometries and wire diameters under a purely mechanical load. Design/methodology/approach - Bond wires with different geometries were tested with various loads and a mechanical test bench, and their endurance was determined. The same load situation was modelled with finite element analysis and then compared against the experimental results. Findings - A correlation was found between the plastic strain per cycle and the determined lifespan. Therefore, the lifespan can be calculated by mechanical-plastic simulation for various loop geometries and loading cases. Practical implications - The loop height strongly influences the durability of the wire bond, whereas other parameters, such as the loop angle, have a weaker influence on the bond heel lifetime. Originality/value - The mechanical simulation is able to replace the time-consumin g lifetime experiments.