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  4. Silicon microsystems: merging sensors, circuits and systems
 
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1998
Conference Paper
Title

Silicon microsystems: merging sensors, circuits and systems

Abstract
While the electronic properties of silicon are widely utilized in high-volume IC manufacturing, the use of its mechanical as well as its other properties is still lagging behind. Recent advances in IC-compatible micromachining techniques, however, have created the technological basis for constructing miniature, high-precision, mechanical structures in and on silicon. Thus microsensors and microactuators can be merged together with sophisticated microelectronics to create microsystems. This tutorial shows that besides lowering manufacturing costs, the silicon integration of both sensors and electronics offers several other significant advantages.
Author(s)
Manoli, Y.
Mokwa, W.
Mainwork
International Conference on Computer Design, VLSI in Computers and Processors 1998. Proceedings  
Conference
International Conference on Computer Design, VLSI in Computers & Processors 1998  
Language
English
Fraunhofer-Institut für Mikroelektronische Schaltungen und Systeme IMS  
Keyword(s)
  • capacitive accelerometers

  • capacitive pressure sensor

  • CMOS-compatible micromachining

  • Drucksensor

  • epiretinal stimulator

  • flow meters

  • implantable sensors

  • microsystems

  • Mikrosystemtechnik

  • multisensor systems

  • Strömungsmessung

  • switched capacitor circuits

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