Integration platform of dual wavelength signal source for 120GHz wireless communication systems

Monolithically integrated photonic signal sources at subterahertz frequencies are becoming an attractive and compact solution for the future wireless communication systems. An optical packaging of dual wavelength DFB laser is presented with the assembly steps required for the optimum optical coupling, RF modulation and DC biasing with optimum wiring circuitry in the housing, and better thermal management while preserving the mechanical stability of housing. The laminate based integration platform to be designed for the various modulating inputs in addition to direct modulation input and active section of laser such as phase shifter and SOAs are illustrated. The additional metallic parts required for better mechanical stability and efficient heat removal during laser operation and high temperature assembly steps are utilized in the packing process. The glass blocks for the optimum fiber positioning in the optical coupling are also the important parts in the assembly proc ess to be highlighted. The whole customized package is illustrated as an example of reliable laser packaging.