SiCer - an advanced substrate for 3D integrated nano and micro systems

A monolithic silicon ceramic sandwich substrate (SiCer) suitable for 3D integration of nano and micro systems is presented. It is high temperature-stable and offers several options for TSV fabrication and wafer level packaging. The ceramic layer acts as carrier. Thus, the silicon layer can be kept as thin as necessary to ensure the electronic or sensor tasks. Silicon systems are separated on the ceramic layer with standard etching technologies. The thermal and electrically isolated MEMS or NEMS devices are stress free connected to a standard carrier system. Prospectively, it is possible to fabricate SiCer as a semi-finished wafer substrate with TSVs and LTCC interconnects in standardised grid dimensions, so user without LTCC/assembling technology can continue e. g. with MEMS processing.