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Process and equipment simulation of copper CVD using Cu(hfac)vtms
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1999
Journal Article
Title
Process and equipment simulation of copper CVD using Cu(hfac)vtms
Author(s)
Wolf, H.
Gieser, H.
Riedel, S.
Streiter, R.
Gessner, T.
Journal
Microelectronic engineering
DOI
10.1016/S0167-9317(98)00257-3
Language
English
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM
