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  4. Laser beam soldering - a new assembly technology for microoptical systems
 
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2005
Journal Article
Title

Laser beam soldering - a new assembly technology for microoptical systems

Abstract
Based on the development of an adhering and solderable layer system microoptical subsystems are joined by laser beam soldering. Fluxless processing with AuSn - solder (80/20 weight%) results in joints that are stable, leak-proof and that contain low mechanical stress. REM - investigations show that the joining area is homogenous. The paper will discuss a number of industrial applications.
Author(s)
Banse, H.
Beckert, E.
Eberhardt, R.
Stöckl, W.
Vogel, J.
Journal
Microsystem Technologies  
DOI
10.1007/s00542-004-0451-y
Language
English
Fraunhofer-Institut für Angewandte Optik und Feinmechanik IOF  
Keyword(s)
  • laser beam soldering

  • fluxless processing

  • AuSn - solder

  • joining technology

  • assembly of microoptical system

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