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  4. Foreword to the special section on "Stress-Induced Phenomena in Microelectronics"
 
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2016
Journal Article
Title

Foreword to the special section on "Stress-Induced Phenomena in Microelectronics"

Title Supplement
Abstract
Abstract
This special section contains papers from the international workshop on ""Stress-Induced Phenomena in Microelectronics"" held at the University of Texas at Austin on October 12-14, 2014.
Author(s)
Ho, Paul S.
The University of Texas at Austin
Zschech, Ehrenfried
Fraunhofer-Institut für Keramische Technologien und Systeme IKTS  
Journal
IEEE transactions on device and materials reliability  
Conference
International Workshop on Stress-Induced Phenomena in Microelectronics 2014  
DOI
10.1109/TDMR.2016.2629519
Language
English
Fraunhofer-Institut für Keramische Technologien und Systeme IKTS  
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