Novel test concept for experimental lifetime prediction of miniaturized lead-free solder contacts

The paper presents the method of generating lifetime-prediction-laws on special prepared specimen. The combination of thin- and thick-film technology allows building up test probes very similar to electronic packages including the measurement issues. Influences of pad surface metallurgy, microstructure of solder and ineutectic solder alloys will be regarded. The investigation objects provide monitoring of electrical and mechanical damage process of SnAgCu-solder bump. Different thermo-mechanical loads will be applied in ranges of 0°C to +80°C, -20°C to +90°C, -40°C to + 125°C and -50°C to + 150°C. The results of these tests and will give universal lifetime-prediction laws for SnAgCu base solder joints. Main goals are to find coefficients for lifetime prediction models of lead-free SAC-solder. One issue points on the Coffin-Mason relation, which can be used in common FEM-tool. The other problem employs the empirical model of Norris-Landzberg relation.