2014
Conference Paper
Title

Stress Analysis on Cu Through-Silicon Vias with Micro-Raman Spectroscopy

Author(s)
Bayat, Parisa
Vogel, D.
Rodriguez, Raul D.
Sheremet, E.
Zahn, Dietrich R.T.  
Rzepka, Sven  
Michel, Bernd  
Mainwork
Conference
Language
English