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  4. Embroidering electrical interconnects with conductive yarn for the integration of flexible electronic modules into fabric
 
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2005
Conference Paper
Title

Embroidering electrical interconnects with conductive yarn for the integration of flexible electronic modules into fabric

Abstract
This paper shows how common embroidery can be used to integrate electronics into textile environment in a light and cost efficient way. A mechanism has been developed to embroider through flexible electronic modules using conductive yarn, thus creating an interconnection with other modules like sensors, batteries, textile keyboards, etc. Mold encapsulation has been found to improve the electrical contact and support the reliability of the whole system.
Author(s)
Linz, Torsten
Kallmayer, C.
Mainwork
Ninth IEEE International Symposium on Wearable Computers 2005. Proceedings  
Conference
International Symposium on Wearable Computers (ISWC) 2005  
Open Access
File(s)
Download (1.29 MB)
Rights
Use according to copyright law
DOI
10.1109/ISWC.2005.19
10.24406/publica-r-348110
Additional link
Full text
Language
English
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM  
Keyword(s)
  • wearable electronic

  • electronic in textile

  • integration

  • packaging

  • interconnection

  • embroidery

  • encapsulation

  • smart textile

  • intelligent textile

  • embroidered interconnection

  • conductive thread

  • washability

  • flexible substrate

  • microintegration

  • reliability

  • design rules

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