Converging technologies and demands toward high-bandwidth optical interconnects

In last decades various approaches have been investigated within frame of photonics research activities. From hybrid assembly to monolithically integration including III-V and CMOS technologies, the main challenges remained: cost effective, high bandwidth, high-density devices, components and subsystems. This paper will review basic photonics packaging approaches/concepts which have been developed over years in different research projects and platforms. Furthermore, targeting the converging technologies the demands on future heterogeneous integration perspective will be discussed with respect to high bandwidth interconnects.