Automated wafer separation using water-jets
The separation of wafers after the sawing process is still a challenge for automation. In recent years, numerous equipment suppliers have invested considerable efforts to meet the customer needs in terms of throughput, uninterrupted processing and high yield. Additionally, some wafer manufacturers have developed their own proprietary solutions. However, the mechanical stress on the wafer still needs to be reduced. Furthermore, a greater flexibility is required to cope with different wafer thicknesses. Recent work therefore focused on a new solution in which the separation process is solely based on water-jets separating and transporting the single wafer. This method was chosen to reduce the mechanical stress on the wafer and at the same time to enable the work with different thicknesses of wafers.