Connecting and encapsulation technology for active middle ear implants
A prototype of an active middle ear implant has been built and tested in human temporal bones. The complete implant is encapsulated by coating with Parylene C to prevent corrosion and degradation of the electrical components. The photo diode sensor generates a maximum signal of about 1,3V which is enough to drive the membrane based piezo actor with amplitudes of about 1µm at 1kHz. The new technology is a promising approach for next generation of active middle ear implants. Flexible, bio stable and mechanical robust connecting technology based on thin polyimide cables allow the assembly of miniaturised electronic components for this active implant.