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  4. Record fast thermal processing of 17.5 % efficient silicon solar cells
 
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2002
Journal Article
Title

Record fast thermal processing of 17.5 % efficient silicon solar cells

Abstract
Presents the development and analysis of 17.5% efficient silicon solar cells on 0.9 Omega cm PV-grade Czochralski silicon (Cz-Si), featuring a record small thermal process time of 1 min for diffusion and oxidation. The cells have been processed by rapid thermal processing (RTP) using incoherent light as an energy source. The involved processes consist of a 5 s RTP step at 930 degrees C for the simultaneous formation of the phosphorus-doped emitter and of the aluminium back surface field (Al- BSF) and a 30 s rapid thermal oxidation (RTO) at 950 degrees C for the emitter surface passivation. Both processes feature high heating and cooling rates of 100 K s/sup -1/. The results show that no lengthy gettering or post diffusion annealing steps are required for the fabrication of high efficiency Cz-Si solar cells and that high heating and cooling rates are applicable. Detailed analysis reveals that the emitter saturation current J/sub 0e/ is reduced by a factor of 3-4 after the RTO passivation in spite of the high carrier surface concentrations of 3 to 4 x 10/sup 20/ cm/sup -3/. Furthermore, one-dimensional device simulations are presented which show that the achieved efficiencies are limited by the effective back surface recombination velocity S/sub back/ resulting from the thin Al-BSF applied.
Author(s)
Peters, S.
Ballif, Christophe
Borchert, Dietmar  
Schindler, Roland
Warta, Wilhelm  
Willeke, Gerhard
Journal
Semiconductor Science and Technology  
DOI
10.1088/0268-1242/17/7/307
Language
English
Fraunhofer-Institut für Solare Energiesysteme ISE  
Keyword(s)
  • silicon solar cell

  • record fast thermal processing

  • PV-grade Czochralski silicon

  • thermal process time

  • diffusion

  • oxidation

  • rapid thermal processing

  • incoherent light energy source

  • phosphorus-doped emitter

  • aluminium back surface field

  • rapid thermal oxidation

  • emitter surface passivation

  • high heating rate

  • high cooling rate

  • fabrication

  • emitter saturation current

  • high carrier surface concentration

  • one-dimensional device simulation

  • efficiency

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