Entwicklung eines neuartigen, quantitativen Adhäsionsmessverfahren für Dünnfilmlagen in der Mikroelektronik

New packaging technologies like Fan-Out lead to a higher integration density causing the layer interfaces to experience a higher stress due to the more dense packaging of materials with different properties e.g. a different coefficient of thermal expansion. This work presents a novel test method (Stripe Lift-off Test - SLT) for the adherence characterization of thin film layers used in microelectronics like the interdielectric polymer layers. The method is based on a modified edge lift-off test (mELT). The value for the adherence of the polymer layer on different material surfaces, like silicon, silicon dioxide and metals, can be measured. Based on the results of the test, the critical energy release rate (J/m²) can be estimated, which allows the quantification of the interface's fracture toughness. The energy release rate sets the basics for fracture simulation of microelectronic devices and could be used for packaging reliability predictions. Due to the usage of intrinsic forces, no clamping or gluing of the layer is necessary for the adhesion measurement. The measurement can be done at room temperature - in contrast to a mELT, which is running at negative temperatures. Exemplary adhesion measurements are presented for polymer films.